All You Need to Know About ESD in RFID Inlay Converting

RFID inlays are ESD-sensitive products, and converting can expose them to static generated by continuous web motion, rollers, nip points, and rewinding. This guide covers general ESD guidelines, the ESD risks in RFID converting, and recommended methods to reduce static charges. For additional guidance, View Recommended ESD Practices

ESD risks in RFID converting

RFID inlays are ESD-sensitive products, and converting can expose the product to static generated by continuous web motion, rollers, nip points, and rewinding.
Risk mechanism Typical converting source Potential consequence
Direct ESD Person/tool/fixture contacts exposed inlay IC damage
Charged-device event Charged web, roller, conductive tooling, or inlay Damage to the IC when charge finds a discharge path
Static buildup Peel, unwind, rewind, slitting, lamination, rubbing Charge accumulation on web or components, resulting in discharge and damage to the IC

Note: ESD events can occur anywhere in the conversion process, including after inline test.

General ESD guidelines

  • Keep people, machines, unwind/rewind equipment, tooling, and other conductive objects at the same electrical potential through appropriate grounding.
  • Neutralize charge on process-essential insulators and moving webs with correctly selected, positioned, and maintained ionization.
  • Minimize charge generation: reduce unnecessary web friction, uncontrolled peel/separation, rubbing, and high-speed air jets.
  • Implement periodic static monitoring of equipment used in RFID conversion.
  • Train personnel on general ESD risks and mitigation activities when handling RFID inlays.
  • Recommend 100% inline multi-point RF testing as part of the conversion process.

On This Page

Static assessment

  • Perform static assessment with the use of a static field meter. Recommended static levels are not to exceed ± 2 kV at any point in the production process.

Grounding

  • Establish a verified common-point grounding system appropriate to the facility.
  • Static control brushes and/or static control cord can be used along the web path as effective grounding solutions during the conversion process.

Ionization

  • Where the use of static control brushes and/or static control cords cannot be used, consider implementing ionization equipment (e.g. ionization fans, needle point ionizers, and/or air discharge ionizers).
  • Consult the ionizer original equipment manufacturer for installation, operation, and maintenance of the ionization equipment.

Environmental

  • Recommend 40–60% relative humidity for the production area(s).
  • Low humidity environments should be avoided.

Key thresholds

MAX STATIC LEVEL
± 2 kV
RELATIVE HUMIDITY
40–60%
INLINE RF TESTING
100%

Standards

For more details, consult ANSI/ESD S20.20-2021 and IEC 61340-5-1:2024, which provide the framework for an ESD control program.

Frequently Asked Questions

What static level is recommended in RFID converting?
Recommended static levels are not to exceed ± 2 kV at any point in the production process.
40–60% relative humidity is recommended for the production area(s), and low-humidity environments should be avoided.
100% inline multi-point RF testing as part of the conversion process.
ESD events can occur anywhere in the conversion process, including after inline test.
ANSI/ESD S20.20-2021 and IEC 61340-5-1:2024 provide the framework for an ESD control program.

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